Technology scaling along with unprecedented levels of device integration has led to increasing numbers of analog/mixed-signal/RF design bugs escaping into silicon. Such bugs are manifested under specific system-on-chip (SoC) operating conditions and …
The proliferation of third-party silicon manufacturing has increased the vulnerability of integrated circuits to malicious insertion of hardware for the purpose of leaking secret information or even rendering the circuits useless while deployed in …
The test generation problem for analog/RF circuits has been largely intractable due to the fact that repetitive circuit simulation for test stimulus optimization is extremely time-consuming. As a consequence, it is difficult, if not impossible, to …
In production testing of analog/RF ICs, application of standard specification-based tests for IC classification is not always an attractive option due to the high costs and test times involved. In this paper, a new test generation algorithm for IC …
As RF design scales to the 28nm technology node and beyond, pre-silicon simulation and verification of complex mixed-signal/RF SoCs is becoming intractable due to the difficulties associated with simulating diverse electrical effects and design bugs. …